Thermal Performance Analysis in Sinusoidal-Cavities-Ribs Microchannel Heat Sink with Secondary Channel Geometry for Low Pumping Power Application

Abstract

The increases in the demand for high performance electronic device has led cooling technology from air cooling to liquid cooling method in order to prevent the operating temperature in the electronic device goes beyond the junction temperature of the electronic device. Liquid as a heat transportation in a micro-cooling technology is an effective method to maintain the operating temperature. Among the micro-cooling technology, microchannel heat sink appears as a promising method that provides high heat transfer rate with minimal pressure drop. However, the conventional microchannel heat sink which has straight channels (CR MCHS) inadequate to remove high heat flux generated by the current devices due to high thermal resistance in laminar region. High heat transfer rate just can be obtained in the microchannel heat sink by using a large mass flowrate which affects the pumping power consumption. The method is not suitable for the low pumping power application. So instead of increases the mass flowrate, in this paper, a hybrid microchannel heat sink was proposed in order to satisfy the cooling demand with low pumping power consumption. The effect of sinusoidal cavities, rectangular ribs and secondary channel geometry on thermal resistance and pumping power in the hybrid microchannel sink (SD-RR-SC MCHS) was studied numerically. The result showed the SD-RR-SC MCHS and RR MCHS had the lowest thermal resistance and temperature variation for the mass flowrate that less than 6.78×10−5 kg/s. Despite both designs had a similar thermal performance with the average deviation of 5%, SD-RR-SC MCHS required only 11.3% of CR MCHS pumping power, while RR MCHS required 31.3% of CR MCHS pumping power in order to achieve the optimum thermal performance of CR MCHS. Means, SD-RR-SC MCHS is the most suitable design which can fulfil cooling demand for low pumping power application.