Thermal Network Model of IGBT Module Based on the Influence of Temperature

Abstract

Considering potential applications in wide temperature range (such as space missions), in this article, a thermal network model of power electronic devices considering the influence of temperature proposed. First, the space environment and traditional RC thermal network model methods are introduced in detail. And the relationship between thermal conductivity and temperature is found out. Then, on this basis, a thermal network model considering the influence of temperature on the thermal conductivity and is established and the parameters in the model are calculated. Finally, the validity and accuracy of the model are verified by comparing the junction temperature calculated by the model with the finite element simulation value in the simulation software COMSOL. The heat transfer coefficient at the bottom of the module and chip power consumption condition are changed for further verification.