Abstract
A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.
Highlights
Thermosyphons are two phase closed heat transfer system containing small amount of liquid which uses the latent heat of evaporation and condensation to transfer heat between the heat source and the sink without any external devices
A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling
The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model
Summary
Thermosyphons are two phase closed heat transfer system containing small amount of liquid which uses the latent heat of evaporation and condensation to transfer heat between the heat source and the sink without any external devices. Heat sinks are effective heat transfer devices which have larger heat transfer area and lower thermal resistance between the source and the sink, thereby enhancing the heat transfer The integration of both thermosyphon and heat sink will enhance the heat transfer between the source and the sink during CPU cooling through heat transfer mechanisms of conduction and convection. In order to enhance the heat transfer at the condenser, a u-shaped longitudinal fin is bonded with the thermosyphons. This entire cycle repeats again and again to maintain the operating temperature of the CPU within the limit
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