Thermal management: understanding how to incorporate effective thermal strategies into overall portable electronic design for better performance

Abstract

A critical challenge to the notebook computing industry is the ability to meet the thermal management requirements of higher power notebook computers. To better understand these requirements, GE Plastics included extensive thermal testing as part of Operation Fulcrum. This paper will present valuable information about the relative performance of various notebook thermal management solutions. Overheating of internal components not only effects the operational performance of the notebook, but can also cause irreparable damage to the system. From an ergonomic perspective, attention is also focused on the external temperature of the notebook since excessive surface temperatures can result in user discomfort in the lap or palm area. With these two concerns in mind, GE Plastics conducted extensive thermal testing to measure both internal component temperatures and external notebook surface temperatures. These tests captured a detailed picture of thermal performance, not only for each unit, but across the notebook computer industry. The test results, along with observations of current thermal designs, have been combined with detailed CFD thermal analyses to develop the thermal management solution found in the Fulcrum Notebook Concept.