Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

Abstract

We investigated the thermal performance of micro-hole cellular structure using Al2O3–H2O and CuO–H2O nanofluids with 0.67% and 0.4%, respectively, of volumetric concentration numerically and then validated these numerical results with the experimental results at a heating power of 345 W. We found that the thermal conductivities of Al2O3–H2O and CuO–H2O nanofluids were enhanced by 2% and 1.19%, respectively, as compared to the base fluid (water). Using Al2O3–H2O nanofluids, we achieved the minimum base temperature of 24.5 °C and 26.6 °C numerically and experimentally, respectively, for the micro-hole cellular structure. Using CuO–H2O nanofluids, we achieved the minimum base temperature of 25.5 °C and 27.7 °C numerically and experimentally, respectively. The estimated errors between obtained numerical and experimental results were 8.8% and 8.5% for Al2O3–H2O and CuO–H2O, respectively. Experimentally, we achieved the lowest base temperature of 26.6 °C and 27.7 °C using Al2O3–H2O and CuO–H2O nanofluids, respectively, which was about 17.6% and 14.5% lower than the reported temperature value of 32.3 °C using water (Tariq et al. in Therm Sci, 2018. http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T ).