Abstract
Double sided surface mount assembly (SMA) can increase packing density but also pose some manufacturing problems as it requires a two-pass reflow process. Methodologies are proposed in this paper to improve the robustness of this double pass process. Based on thermal analysis, certain combinations of surface mount components and certain sequences of the thermal reflow process should be avoided because of much higher risks affecting quality and yield. However, if such combinations and sequences are unavoidable, methods of differential heating can be exploited to improve the manufacturability of this double sided SMA.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
