Thermal Isolation within High-Power 2.5D Heterogenously Integrated Electronic Packages

Abstract

We propose a two-pronged approach to reducing the impact of thermal cross-talk between components of disparate thermal operating points within a heterogeneously integrated electronic package. First, a low thermal conductivity interposer enhanced with an array of conductive thermal vias is employed to provide a high degree of lateral thermal isolation while providing adequate conduction in the vertical direction. Second, a differential embedded microfluidic cooling strategy is proposed that provides high rates of heat removal in the isolated high-power regions while using a low pumping cost background cooling for low-power regions. At the end of this paper, a case study is presented where required device separation is reduced three-fold and required pumping power is reduced by an estimated 40% compared to a silicon interposer with a uniform aggressive cooling strategy.