Abstract
In order to improve the thermal fatigue reliability of LCCC (Leadless Ceramic Chip Carrier) solder joints, the assembly process and failure mechanism of LCCC devices are analyzed. It is concluded that the solder joints height is the main factor to improve its thermal fatigue reliability. Reliability qualification tests are performed to contrast the improvement effect of several methods. The Sn10Pb90 column mounting specimen can greatly improve the fatigue reliability and can adapt to most environmental requirements. Some significant conclusions are drawn by comparing the tests results of different specimens. The method can also be used for the other package types to improve the reliability.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
