Abstract
The authors have proposed the estimating method of thermal fatigue reliability for solder joints of electronic package, using the total equivalent inelastic strain range Δein and Manson-Coffin's law. However, as it is difficult to calculate it in the case of huge models, it is needed to establish a simple calculation method of Δein. In this study, the authors proposed a simple approach of FEM analysis for calculation of Δein. Approximate formula for relative displacements of solder joint using the results of the elastic analysis was examined in order to simplify huge inelastic analysis. In addition, using Statistical Design Support System (SDSS), they made the equation of inelastic strain range in the solder joints. And proposed simple estimation method of thermal fatigue life.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
