Abstract
The fatigue behaviour of solder joints in ceramic LTCC modules on FR-4 boards was investigated using thermal fatigue experiments at temperature intervals of 0 – 100°C and −40 – 125°C, and non-destructive and SEM/EDS investigations of thermally cycled modules. Dissolution reactions and formation of tin-based intermetallics were encountered in the joints and found to cause degradation in them. A high peak reflow temperature in the fabrication of modules had a detrimental effect on performance. Vias filled with silver located under the central regions of the solder pads of the LTCC modules enhanced the reliability of the solder joints.
Published Version
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