Thermal expansion and thermal conductivity of In2S3 and CuIn5S8 compounds and (CuIn5S8)1 − x (In2S3) x alloys

Abstract

Thermal expansion and thermal conductivity are studied in the respective temperature ranges 80–600 and 300–600 K for In2S3 and CuIn5S8 single-crystal compounds and (CuIn5S8)1 − x(In2S3)x alloys grown by planar crystallization of the melt (the vertical Bridgman method). From the data, the thermal-expansion coefficient αL is calculated. The dependences of the thermal-expansion coefficient αL and the thermal conductivity χ on the composition parameter x are constructed. It is established that αL linearly varies with x, whereas χ has a minimum at intermediate values of x.