Thermal dynamics in electronic and switching components

Abstract

The concept of a viable electronic system and needs a thermal study to be performed on the particular geometries and structures of power electronic components. In effect the analysis of heat transfer in the electronic components rests on the fundamentals of heat transfer. The details reside essentially in the geometry and the structure of the devices, and in the spatial distribution of the heat sources. Also, from the concept of the electronic systems the thermal model is considered essential pending the simulation of the junction temperatures of the electronic and switching components. In effect, the model mixes the index up to maintenance having a certain limitation of applications and the precision diminishes with increasing switching frequency, which is unacceptable for many manufacturers of electronic equipment. In this article we present our study results on the thermal dynamics which characterise the thermal aspects in the switching regime of the electronic components.