Abstract
Light-emitting diode (LED) is an electronic device with high heat flux. The simulation and analysis of the heat dissipation play an important role in the improvement of performance and design of LED module. In this paper, a thermal model was developed using ANSYS software to simulate the temperature distribution of LED module. The effect of thermal conductivity of MCPCB (metal-core printed circuit board) substrate on the heat dissipation of LED module in the vertical direction and MCPCB substrate in the length and width direction was evaluated. A mathematical formula to describe the vertical temperature distribution of LED module was developed. The results showed that the maximum temperature of LED module and the temperature gradients near the outer edge of the contact surfaces between cooling blocks and MCPCB substrate decreased with the increase of thermal conductivity of MCPCB substrate.
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