Abstract

Technological progress in electronics usually requires their use in increasingly aggressive environments, such as rapid thermal cycling and high power density. Thermal diodes appear as excellent candidates to thermally protect critical electronic components and ensure durability and reliability. We model the heat transport across a square plate with a hole subjected to an oscillating external temperature, such spatial and temporal symmetries are broken. We find rectification of the heat current that strongly depends on the frequency and the geometry of the hole. This system behaves as a thermal diode that could be used as part of a thermal architecture to dissipate heat under cycling temperature conditions.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call