Abstract
Abstract— Thermal dimensional stability of Fusion‐drawn Corning Code 1737 glass was investigated at simulated thermal cycles for low‐temperature poly‐Si TFT fabrication. For low‐temperature poly‐Si TFT processes between 550 and 600°C, annealed Code 1737 is required to meet a typical thermal shrinkage requirement of less than 20 ppm. For super‐low‐temperature poly‐Si TFT processes between 400 and 450°C, Code 1737 meets the requirement in the unannealed state. Code 1737 glass having a high strain point of 666°C provides thermal capabilities as a substrate for low‐temperature poly‐Si TFT‐LCD applications.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
