Abstract

A generalized model for the open photoacoustic cell configuration (OPC) technique, involving one-dimensional heat diffusion across two layers, is presented. The analytical results are particularly suitable for applications with dielectric solids, such as polymers and resins. Two effective normalization procedures for simple and reliable measurement of the thermal diffusivity of this kind of materials using an OPC are also presented. The thermal diffusivity of three different materials (a dental resin, an epoxy resin, and a polymer foil) was measured and excellent agreement was obtained with some values reported in the literature. © 2001 American Institute of Physics.

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