Abstract
In-plane and out-of-plane thermal diffusivities (conductivities) of Kerimid resin composites reinforced with various types of filler were studied both experimentally and theoretically. The types of filler used are SiO2 particle, Al2O3 short fiber, Boron Nitride (BN) flake, and Si3N4 whisker. The prediction based on our previous model (Eshelby's equivalent inclusion method) agreed reasonably well with the experiment, except for BN flake composite. It was found that the orientation of filler has a strong effect on the overall thermal conductivity of a composite.
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