Abstract
There was a thermal model established for the packaged power IC chip which is usually used in the design of a class amplifier. After the theoretical analysis of the equivalent chip thermal resistance model carried out on the basis of thermal resistance theory, the optimization and calculation of the baseboard's material and thickness were simulated with Icepak. The acceptable thermal structure of was showed as suggestions for the reliability of chip with discussions of the simulation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
