Abstract
Attendant Control Panel (ACP) is a wall mounted unit which mainly integrates several Boeing 737NG system functions into a single control panel to provide the flight attendants with the ability to monitor and control cabin features. Thermal design has been developed to remove heat from the ACP through conduction and natural convection. Standoffs in the enclosure provided the effective conduction path to transfer heat from PWA (Printed Wire Assembly) to chassis. All critical device temperatures in the ACP are able to maintain well below the allowable temperature limit of 105o C without forced cooling. CFD(Computational Fluid Dynamics) simulations have been carried to analyze and improve thermal phenomena inside the ACP for three operating conditions namely normal operating (30o C), high operating (50o C) and short range operating (50o C to 60o C for 30 min) , using ANSYS Icepack, commercial CFD software. The thermal design of ACP is developed in this paper to maintain its operating temperature within the limits, without any electrical degradation. Keywords: ACP - Attendant Control PanelL, PWA - Printed Wire Assembly, CFD - Computational Fluid Dynamics, LCD - Liquid Crystal Display, LRU - Line Replaceable Unit, PCB - Printed Circuit Board.
Highlights
Micro system technology is driven by specific requirements such as the high integration density of the single elements and the three-dimensional integration of the elements in a hybrid system
A conventional finned heat sink operates most efficiently when air is moving parallel to the orientation of its fins [2]
The thermal design of electronic equipment has a significant impact on the cost, reliability, and tolerance to different environments [3]
Summary
Micro system technology is driven by specific requirements such as the high integration density of the single elements and the three-dimensional integration of the elements in a hybrid system. The use of new materials having specific properties, as well as the overall miniaturization of the systems have led to an increased importance on thermal management issues in this industry [1]. In any un-fanned environment, the air flow is to move vertically due to convection and the heated air’s tendency. Similar to the fin configuration, a thermal design with standoffs offered the best performance to conduct heat from ACP. The thermal design of electronic equipment has a significant impact on the cost, reliability, and tolerance to different environments [3]. ACP enclosure houses two PWAs (baseboard and mezzanine) inside the cage body. The baseboard PWA is mounted on the chassis using nine standoffs and three rails. The mezzanine PWA is mounted on top of the baseboard PWA using four standoffs and one rail along its edge.
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