Abstract
With the rapid development of society, the new generation of high-power LED light source has many advantages, such as low energy consumption, fast response, vibration resistance, high efficiency and long service life. However, the problem of heat dissipation of high-power LED also makes people rack their brains. How to efficient heat dissipation is the key to improve the output power and extend the working life. In this paper, the fluid heat transfer simulation analysis was carried out by floEFD embedded in UG environment, and the simulation of PCB related materials of LED headlights and the influence of fin length on LED headlights were carried out to solve the problem of the coupling relationship between LED temperature and thermal power in the simulation process. At the same time, in order to improve the heat dissipation better, a heat pipe is added to the simulation, and the temperature of LED chip can be reduced better through the combination of heat pipe and fin.
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