Abstract
AbstractDynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis (DEA) were conducted for three thermoset resin systems: bismaleimide, epoxy, and vinyl ester. The resin samples were subjected to various degrees of thermal exposure (400, 270, and 330°C for 5–150 min). Dielectric constants were measured along with the thermomechanical properties. The glass‐transition temperature, modulus, and weight loss were important parameters for correlating the material property changes with the heat exposure. A linear relation was determined between the thermomechanical properties and the dielectric properties of the resins under the selected exposure conditions. Therefore, DEA can be introduced as a significant technique for evaluating thermally exposed polymer materials. Interestingly, it is a nondestructive evaluation process. In the future, it could be used for onsite health monitoring of thermally exposed polymer matrix composite structures. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009
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