Thermal deformation measurement of electronic packages using the atomic force microscope scanning moiré technique

Abstract

In this article, the feasibility of atomic force microscope (AFM) scanning moiré on a cross-line diffraction grating has been studied. The AFM scanning moiré technique has been applied to measure the thermal deformation of electronic packages successfully. This technique is convenient to perform the mismatch method, also it could obtain a higher resolution than any other moiré method.