Abstract
We report the electrochemical deposition of Sn–Ni and In–Ni alloys containing 20 and 45 wt % of the lower melting point component. The percentage of nickel in the deposited alloys has been determined by gravimetric analysis. We have studied the thermal behavior of the deposited materials in heating–cooling cycles in the temperature ranges 50–250, 50–300, and 50–400°C. The results of this study can be useful in high-density mounting using Pb-free solder materials with a preset soldering temperature.
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