Abstract
Abstract—
 The thermal contact resistance of a detachable connection in copper-copper contact pair with a thermal interface from layers of graphene synthesized by the method of a low pressure chemical vapor deposi-tion on the contact surface was studied. Obtaining the value of the thermal contact resistance of a detachable contact pair copper–graphene–copper by the method of transient heat flow, at a temperature of 15–150 K under the influence of an external magnetic field up to 10 T.
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