Abstract
Alloys between tin and tin telluride have been prepared and their thermal conductivity has been measured in the temperature range ~90–300 K. We have determined the lattice (χl) and electron (χel) contributions to the thermal conductivity of the alloys and their thermal resistivity due to structural defects (Sn vacancies and defects). We assume that, at low excess Sn concentrations, Sn atoms form electroneutral complexes with Sn vacancies, leading to a reduction in χl and χel. At high concentrations, Sn atoms fill vacancies, leading to an increase in χl.
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