Abstract

${\mathrm{Al}}_{x}{\mathrm{Ga}}_{1\ensuremath{-}x}\mathrm{N}$ ternary alloys are emerging ultrawide band gap semiconductor materials for high-power electronics applications. The heat dissipation, which mainly depends on the thermal conductivity of the constituent material in the device structures, is the key for device performance and reliability. However, the reports on the thermal conductivity of ${\mathrm{Al}}_{x}{\mathrm{Ga}}_{1\ensuremath{-}x}\mathrm{N}$ alloys are very limited. Here, we present a comprehensive study of the thermal conductivity of ${\mathrm{Al}}_{x}{\mathrm{Ga}}_{1\ensuremath{-}x}\mathrm{N}$ in the entire Al composition range. Thick ${\mathrm{Al}}_{x}{\mathrm{Ga}}_{1\ensuremath{-}x}\mathrm{N}$ layers grown by metal-organic chemical vapor deposition on GaN/sapphire and GaN/SiC templates are examined. The thermal conductivity measurements are done by the transient thermoreflectance method at room temperature. The effects of the Al composition, dislocation density, Si doping, and layer thickness on the thermal conductivity of ${\mathrm{Al}}_{x}{\mathrm{Ga}}_{1\ensuremath{-}x}\mathrm{N}$ layers are thoroughly investigated. All experimental data are fitted by the modified Callaway model within the virtual crystal approximation, and the interplay between the different phonon scattering mechanisms is analyzed and discussed.

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