Thermal conductivity enhancement of epoxy by a 3D Si3N4 crystal rod/grain skeleton fabricating from photovoltaic silicon waste

Abstract

Silicon nitride (Si3N4) is one of the preferred fillers for the preparation of high thermal conductivity polymer composites because of its intrinsic high thermal conductivity and good electrical insulation. To maximize the thermal conductivity enhancement effect of the fillers in the composites, it is necessary to pre-construct a three-dimensional (3D) thermally conductive filler network. Herein, surfactant foaming was applied to pre-construct a 3D Si-containing framework from photovoltaic silicon waste (PSW), which was subsequently transformed into a porous skeleton consisting of Si3N4 rods and grains by in-situ nitridation reaction sintering. And finally, thermal conductive Si3N4/epoxy (EP) composites were fabricated after infiltrating EP into the network skeleton. When the filler content of Si3N4 was 41.00 vol%, the obtained Si3N4/EP composite showed the highest thermal conductivity of 2.99 W·m-1·K-1, which was 13.95 times higher than that of pure EP. Tests on running CPU and heating table showed that the Si3N4/EP substrate had excellent heat dissipation performance compared to the pure EP substrate. The 3D continuous network formed by "bridging" between two different morphologies of Si3N4 microcrystals contributed to providing effective multi-directional heat transfer paths and thereby improving the thermal conductivity of the composites. Overall, the low cost of raw silicon source originating from industrial waste as well as the simple and practical construction of heat-conducting filler network demonstrate the promising application of the Si3N4/EP composites fabricated in our work.