Abstract
The thermal diffusivity (TD) and thermal conductivity (TC) of Cu–Cr–diamond composite materials were examined in the temperature range from 50 to 300 °C for diamond volume fractions of 22, 40, 50, 55, and 60 %. The samples were fabricated by the plasma pulse sintering (PPS) method. TC does not increase proportionally with the diamond fraction in the particular composite materials. The highest TD was determined for 50 % diamond volume fraction, and the evaluated TC reached 658 W m−1 K−1 at 50 °C. This article complements earlier articles concerning synthesis and characterization of the diamond–copper composites produced by the PPS method.
Highlights
Heat fluxes more often turn out to be a problem during the manufacturing of various products or during the usage
The Maxwell equation [5], which assumes perfect bonds, shows that the theoretical value of the effective thermal conductivity of the copper–diamond material in proportion 1:1 reaches 842.1 W m-1 K-1 for kCu = 400 W m-1 K-1 and kD = 1,800 W m-1 K-1. This means that the thermal conductivity of 1:1 Cu–diamond composites will never reach that value, whatever be the size of diamond particles applied
thermal conductivity (TC) estimated by thermal diffusivity (TD) measurement of copper–diamond composites with chromium additives was investigated
Summary
Heat fluxes more often turn out to be a problem during the manufacturing of various products or during the usage (for example, electronics). Abstract The thermal diffusivity (TD) and thermal conductivity (TC) of Cu–Cr–diamond composite materials were examined in the temperature range from 50 to 300 °C for diamond volume fractions of 22, 40, 50, 55, and 60 %. Among materials studied for heat sink applications, diamond–metal composites are becoming more and more popular [1] because of their intriguingly high thermal conductivity.
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