THERMAL CONDUCTIVITY and TENSILE PROPERTIES OF HOLLOW GLASS MICROSPHERE / POLYPROPYLENE COMPOSITES

Abstract

In this study, hollow glass microspheres (HGM) filled polypropylene (PP) composites were prepared by melt extrusion method. In order to understand the effect of structure and physical properties on the performance of composites, the morphologies, tensile properties and thermal conductivities of composites were investigated. The surface of HGMs were modified with 3-(Trimethoxysilyl) propyl methacrylate ( TMSM ) silane coupling agent to improve the compatibility between PP matrix and HGMs. The physical properties of silane modified and unmodified HGMs were characterized by Fourier Transform Infrared Spectroscopy (FT-IR) and Scanning Electron Microscope (SEM). The effect of HGM content and surface modification of HGM on morphological, mechanical and thermal conductivity properties of composites were evaluated. The results indicated that the surface modification of HGM enhance the interfacial region between HGM and polymer matrix. When 20 wt % modified HGM was added to neat PP, the modulus of the composite obtained was 1057 MPa, increasing by 15.1% compared with that of the PP/unmodified HGM composite. However, any positive or consistent effect of surface modification and HGM addition on thermal conductivity of samples can not be observed.