Thermal conductivity and interfacial energies of solid Sn solution in the Sn–Ag–In ternary alloy

Abstract

The equilibrated grain boundary groove shapes of solid Sn solution in equilibrium with the Sn–Ag–In liquid have been observed from quenched sample. The Gibbs–Thomson coefficient, solid–liquid interfacial energy and grain boundary energy of solid Sn solution have been determined. The thermal conductivity values for solid Sn solution (Sn–2.1 at.%In) and eutectic solid (Sn–4.4 at.%Ag–2.1 at.%In) and the thermal conductivity ratio of eutectic liquid phase to eutectic solid for Sn–4.4 at.%Ag–2.1 at.%In alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, respectively.