Thermal conductivity and interfacial energies of solid Sn in the Sn–Cu alloy

Abstract

The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn–Cu eutectic liquid were observed from a quenched sample. The Gibbs–Thomson coefficient, solid–liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 ± 0.6) × 10 −8 Km, (113.1 ± 13.6) × 10 −3 J m −2 and (222.4 ± 28.9) × 10 −3 J m −2, respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn–1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively.