Abstract
This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core–shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m−1 K−1, and a −4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm−1, which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield’s packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and Al2O3 ceramic powders of a 1-μm diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure.
Highlights
Digital mobile electronics have dramatically evolved since their appearance in the late 1990s.With the evolution of mobile electronics, plenty of subsidiary technical challenges have been solved
Thermal- and electromagnetic interference (EMI)-related problems are generated in an electronic device simultaneously [1,2,3,4]
As the milling time increased, the proportion of fine aluminum oxide powders with an average diameter of about 1 μm gradually disappeared. This indicates that most of the aluminum oxide powders are attached onto the Fe-12.5%Cr core surfaces
Summary
Digital mobile electronics have dramatically evolved since their appearance in the late 1990s. Thermal- and EMI-related problems are generated in an electronic device simultaneously [1,2,3,4] To solve these issues, thermal interface materials (TIMs), EMI shielding materials, and EMI absorbers have been used separately to date. Because there is not enough space to apply TIMs and EMI absorbers separately in recent slim mobile electronic devices, such as smartphones, tablet PCs, or laptop PCs, Polymers 2020, 12, 2318; doi:10.3390/polym12102318 www.mdpi.com/journal/polymers. Thisneeds is because magnetic coremagnetic bodies, another effective and sophisticated process to be soft applied This materials, is becauseassoft are usually heavy ferrous alloy metals in general, and aluminum oxide as a shell layer has a high density. Traditional specially designed impeller should be and high the revolving speedsome should be mixer makers have developed state-of-the-art technologies and equipment for manufacturing metaland increased to an extremely high level.
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