Abstract

Further development in the field of geothermal energy require reliable reference data on the thermophysical properties of geothermal waters, namely, on the thermal conductivity and viscosity of aqueous salt solutions at temperatures of 293–473 K, pressures Ps = 100 MPa, and concentrations of 0–25 wt.%. Given the lack of data and models, especially for the dynamic viscosity of aqueous salt solutions at a pressure of above 40 MPa, generalized formulas are presented here, by which these gaps can be filled. The article presents a generalized formula for obtaining reliable data on the thermal conductivity of water aqueous solutions of salts for Ps = 100 MPa, temperatures of 293–473 K and concentrations of 0%–25% (wt.%), as well as generalized formulas for the dynamic viscosity of water up to pressures of 500 MPa and aqueous solutions of salts for Ps = 100 MPa, temperatures 333–473 K, and concentration 0%–25%. The obtained values agree with the experimental data within 1.6%.

Highlights

  • For many years, solutions have attracted and continue to attract the attention of many researchers due to the important role they play in all natural phenomena of life and the complexity of their nature that is largely determined by the properties of the liquid phase in general

  • After preparing nanofluids with filler values of 0.025 vol and 0.2% vol and examining their thermal conductivity, the results showed that the thermal conductivity for nanofluids with filler volume of 0.025% is higher than the other

  • For aqueous solutions of binary and multicomponent inorganic substances, in [4,5] proposed a formula for determining the coefficient of thermal conductivity of aqueous solutions of salts, acids, and alkalis at a temperature of 293 K without the coefficient 1.163–for a unit of measurement of thermal conductivity in kcal/(m·h·deg), and the author of this paper introduced 1.163 to measure the thermal conductivity coefficient in W/(m·K): X

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Summary

Introduction

Solutions have attracted and continue to attract the attention of many researchers due to the important role they play in all natural phenomena of life and the complexity of their nature that is largely determined by the properties of the liquid phase in general. The use of suitable nano additives to improve and increase the cooling property in industrial devices can be effective in reducing the hot spot temperature, which is one of the design limitations [7,8]. It increases the nominal power, reduce the dimensions and consumables in equipment as coolant. Studies on nanofillers show that increasing the thermal conductivity of nanofluids depends on many variables [9,10,11,12] These factors include nano-filler size, particle surface shape and area, filler volume, particle aggregation, stability, viscosity, brown motion and temperature effect. After preparing nanofluids with filler values of 0.025 vol and 0.2% vol and examining their thermal conductivity, the results showed that the thermal conductivity for nanofluids with filler volume of 0.025% is higher than the other

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