Thermal conductivities of composites with ultradispersed titanium nitride-aluminium nitride: O.L. Dozhdikova et al, Poroshkovaya Metallurgiya, No 5, 1992, 70–74. (In Russian).

Abstract

Aluminum nitride–titanium nitride (AlN–TiN) composites (TiN content; 0, 5 and 10 vol.%) were prepared using mixtures of fine AlN and TiN powders. Pressureless sintering of the AlN–TiN powder mixtures was done at 1850°C for 1 to 20 h, using yttrium oxide powder as a sintering aid. Sintered samples achieved almost full density. While AlN grains grew isotropically with sintering time, TiN particles in the composite maintained their small and nearly round shape. The TiN grains were present at both grain boundary and within AlN grains. Heat treatment of these composites caused both microstructural change and improvements in thermal diffusivity. Inhibition of AlN grain growth was greatest for the 10 vol.% TiN–AlN composites.