Abstract
This paper presents extended loss analysis and thermal characterization of the alternate arm converter (AAC) based on detailed semiconductor models. Due to the uniqueness in structure and operation of the AAC topology compared to other modular topologies in the family of modular multilevel voltage source converters, extensive thermal analysis is important to evaluate its performance, reliability, and life-time for high-voltage direct current (HVDC) applications. This paper accommodates preliminary results of thermal modeling, losses, and thermal stresses of the AAC for a range of operating cases including lower modulation indexes, different power factors and voltage sags. Results based on a benchmark AAC-HVDC model verify the AAC thermal model and demonstrate the necessity of detailed thermal modeling across diverse operating cases for comprehensive evaluation of thermal stresses in design stages.
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