Abstract
The design, fabrication, and use of a hotspot-producing and temperature-sensing resistance thermometer for evaluating the thermal properties of low-dimensional materials are described in this paper. The materials that are characterized include one-dimensional (1D) carbon nanotubes, and two-dimensional (2D) graphene and boron nitride films. The excellent thermal performance of these materials shows great potential for cooling electronic devices and systems such as in three-dimensional (3D) integrated chip-stacks, power amplifiers, and light-emitting diodes. The thermometers are designed to be serpentine-shaped platinum resistors serving both as hotspots and temperature sensors. By using these thermometers, the thermal performance of the abovementioned emerging low-dimensional materials was evaluated with high accuracy.
Highlights
The semiconductor industry is pursuing electronic systems with higher integration density, more functions, higher power and frequency, and smaller footprint and volume, with lower cost.When the performance increases, the power density in electronics systems becomes higher and higher; heat dissipation becomes a critical issue
We summarize the use of hotspot test structures for the evaluation of the performance of 2D hexagonal boron nitride films as heat spreaders
Before thermal thehotspot single-layer hexagonal boron nitride (hBN) heatthe spreader fabricated on silicon by substrates was not as good as the test structure, qualityon of the the hotspot hBN material was examined
Summary
The semiconductor industry is pursuing electronic systems with higher integration density, more functions, higher power and frequency, and smaller footprint and volume, with lower cost. Thermal characterization of such nanomaterials and nanostructures becomes more important than ever to evaluate their performance. This paper is expanded from a conference conference paper [12] but elaborates upon and includes the most recent published results to review paper [12] but elaborates upon and includes the most recent published results to review the previous the previous work on thermal characterization of various one- and two-dimensional (1D and 2D). Work on thermal characterization of various one- and two-dimensional (1D and 2D) nanomaterial-based nanomaterial-based cooling structures using resistance thermometers. We summarize the thermal characterizations thermal characterizations of different low-dimensional materials using the resistance thermometer. Of different low-dimensional materials using the resistance thermometer.
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