Abstract
A new thermal characterization technique, time-resolved infrared radiometry (TRIR), is used to investigate three different heat sink adhesive systems used in spacecraft electronics - a filled epoxy, a filled silicone and a tape adhesive. Measurements of heat sink efficiency are presented as a function of thermal cycling and the TRIR results are compared with ultrasonic and X-ray imaging techniques and with destructive analysis. The TRIR technique is shown to provide a measure of the relative heat sink capabilities of the different systems and can detect subsurface delamination in the filled epoxy system resulting from the development of cracks due to thermal cycling.
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