Thermal camera for System-in-Package (SiP) technology: Transient thermal analysis based on FPGA and Finite Element Method (FEM)

Abstract

Accurate thermal analysis is essential for the design of reliable of system-in-package (SiP). This paper proposes a transient thermal analysis of the SiP technology based on four chips to study the effect of the underlying layers on the thermal model and to know the optimization scenario of the chips based on the thermal aspect that should be considered for the best possible accuracy. The finite element method (FEM) using the COMSOL Multiphysics® tool is proposed to achieve this goal. The temperature variation in the numerical simulation shows that the underlying layers are very important to decrease the maximum value of the SiP temperature. This work is performed with a field-programmable gate array (FPGA), which acts as a packaged system, and the detected heat source is validated with a thermal camera. A maximum error of 2.4% is reported between the thermal camera measurements and the numerical simulations.