Thermal and Mechanical Characteristics of Polymer Composites Based on Epoxy Resin, Aluminium Nanopowders and Boric Acid

O B Nazarenko,P M Visakh,T V Melnikova

doi:10.1088/1742-6596/671/1/012040

O B Nazarenko, P M Visakh + Show 1 more

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https://doi.org/10.1088/1742-6596/671/1/012040

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Abstract

The epoxy polymers are characterized by low thermal stability and high flammability. Nanoparticles are considered to be effective fillers of polymer composites for improving their thermal and functional properties. In this work, the epoxy composites were prepared using epoxy resin ED-20, polyethylene polyamine as a hardener, aluminum nanopowder and boric acid fine powder as flame-retardant filler. The thermal characteristics of the obtained samples were studied using thermogravimetric analysis and differential scanning calorimetry. The mechanical characteristics of epoxy composites were also studied. It was found that an addition of all fillers enhances the thermal stability and mechanical characteristics of the epoxy composites. The best thermal stability showed the epoxy composite filled with boric acid. The highest flexural properties showed the epoxy composite based on the combination of boric acid and aluminum nanopowder.

Highlights

Epoxy resins are thermosetting polymers which are widely used in industry as adhesives, surface coatings, construction materials due to such properties as high adhesion, chemical resistance, low shrinkage at curing, good mechanical properties [1, 2]
In the present paper, the epoxy composites filled with aluminum nanopowders, boric acid and aluminum nanopowders/boric acid were produced
The thermal stability of the epoxy composites was investigated by thermogravimetric analysis and differential scanning calorimetry

Summary

Introduction

Epoxy resins are thermosetting polymers which are widely used in industry as adhesives, surface coatings, construction materials due to such properties as high adhesion, chemical resistance, low shrinkage at curing, good mechanical properties [1, 2]. In the case of bonding the structural elements of the heating apparatus and electronic devices it is necessary to provide heat removal which requires the improving the thermal conductivity of adhesives. It has been shown in many works that the metal powders addition in the adhesives such as aluminum, copper, silver, etc. The epoxy polymers are characterized by low thermal stability and high flammability To enhance both the functional and flammability properties of the epoxy polymers, nanoparticle fillers are considered to be promising [8,9,10,11].

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