Abstract
VCSEL chips with wavelengths in the range of 700 nm–800 nm, the same as the transition spectral lines of alkali atoms, can be used as light sources for novel miniaturized quantum sensors. The conventional temperature control module for VCSEL is based on a thermoelectric cooler (TEC) and temperature sensor. However, the package size is large, and the magnetic field noise is too large for real applications. In this study, we proposed a chip-scale packaging method with an overall dimension of 4 mm × 6 mm for VCSEL with a 795 nm output wavelength. With temperature uniformity and the magnetic field distribution profiles of the package, chips have been carefully evaluated. The generated magnetic field can decay to less than 100 nT within 3 mm. In all, we not only experimentally demonstrated an applicable thermal package structure, but also gave the magnitude and distance effects of the magnetic field caused by this structure. This study can provide an example and reference for the chip-scale temperature control packaging method of VCSELs and their application in quantum sensors.
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