Thermal and flow performance in a CLPHP with Al2O3/copper nanofluids: Application in microelectronics and power generation

Abstract

Many modern computer CPUs employ heat pipes for thermal management. This study presents parametric characterizations of the device's orientation, inner diameter, working fluid, and fill ratio. The Pulsating heat pipe is a brass tube with a 2 mm inside and 3 mm external diameter. The working fluids were aluminium oxide and copper nanofluids in deionized water, the volume fill ratios were 50%, 60%, 70%, and 80%, and the heat input was set to be between 0 and 100 W. CLPHP's thermal performance was tested at 0°, 30°, 45°, 60°, 75° and 90°. With the addition of Al2O3 nanofluid, the pulsing heat pipe works at a greater heat transfer rate and shows substantial fluid movement at an orientation of 30 degrees. Al2O3-based nanofluid is more precise in heat transmission than copper and deionized water. Operating in a horizontal orientation resulted in an efficient heat transmission rate of 80%.