Thermal and electric conductive analysis in Isotropic Conductive Adhesive by modeling 3D fillers dispersion observed by FIB-SEM

Abstract

Isotropic Conductive Adhesives(ICA) conducting electrically and thermally through metal fillers in resin have been studied macroscopically (the total resistance after mount) and microscopically (the contact resistance between fillers). However, the study of the conductive mechanism between electrodes of parts has not been elucidated yet. The reason is that the flat surface (2D) observation is usually used, though the actual dispersion of fillers is the three dimension (3D). In this paper, we observed 3D dispersion and 3D conductive pathway by FIB-SEM which repeats porishing and observation. In addition, thermal conduction and electric conduction are analyzed by this observation result. Then, the electric and thermal interface resistance can be calculated by the comparison of analysis and experiment. Thermal and electric interface resistance quantified by this study would make ICA higher thermal conduction and electric conduction.