Abstract
The thermal stabilities of copper and tin films containing various organic solvents have been studied by thermogravimetry (TG) between 298 and 823 K under a flow of nitrogen. The thermal stabilities of the Cu films decrease in the order Cu-THF > Cu-DMF > Cu-toluene > Cu-ethanol > Cu-acetone > Cu-2-butanone > Cu-benzene, Cu-2-propanol > Cu-DMSO. On the other hand, the organotin films exhibit a decreasing stability in the following order: Sn-2-propanol > Sn-ethanol > Sn-acetone > Sn-2-butanone, > Sn-benzene > Sn-DMF, Sn-DMSO > Sn-toluene. This suggests that the solvent incorporated into the film has a considerable influence on the stability, in that solvents containing oxygen are very stable and have a comparatively high thermal decomposition temperature (T d ) and low residual weight. The order of the thermal decomposition reaction was found to be zero in most of the cases. The pre-exponential factor and the activation energy of the decomposition of Cu and Sn metal films are also compared.
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