Thermal Analysis of Energy Storage Capacity According to Thickness of Nickel/Chromium Alloy Layer

Yonghyeon Kim,Hyunil Kang,Wonseok Choi,Hyeokjoo Choi,Seokhun Kwon,Seokwon Lee

doi:10.3390/en14113217

Abstract

This paper examines a microconstruction consisting of nickel (Ni)/chromium (Cr) alloy thin-film. The total length of the microconstruction was 28 mm, the width was 0.2 mm, and the height was designed to be 1 μm. A thin-film of Ni/Cr alloy was co-sputtered on a silicon dioxide wafer patterned with photoresist via a RF magnetron sputtering system. The RF power ratios applied to the 4 inch target of Ni and Cr were 300 W:100 W (3:1), 300 W:150 W (2:1), and 150 W:150 W (1:1). The electrical resistance of the manufactured microconstruction was calculated and measured through Hall measurements. The temperature generated by applying 1–10 V to the microconstruction electrode was observed by using an infrared camera, and was summarized using a linear equation according to the power applied to each sample.

Highlights

Energies 2021, 14, 3217. https://Device miniaturization through microfabrication leads to the development of new functions and performance [1,2,3]
A microconstruction based on Ni/Cr alloy thin-film by co-sputtering could be an excellent alternative to expensive Pt or Au
Pt and Au are high-cost materials that are used as targets for sputtering systems, which are important in microfabrication processes

Summary

Introduction

Device miniaturization through microfabrication leads to the development of new functions and performance [1,2,3]. Microconstructions of platinum (Pt) or gold (Au) are robust, stable and can provide a wide temperature range because they have a low coefficient of thermal expansion (Pt: 8.8 ppm/K, Au: 16.5 ppm/K) and resistivity (Pt: 10.9 μΩcm, Au: 2.40 μΩcm) [12,13,14,15]. These materials are too expensive to be used as targets for sputtering systems, which is an important part of the microfabrication process [16]. The heating characteristics were confirmed by applying 1–10 V to the microconstruction electrode and these were expressed as a linear regression equation

Microconstruction Design

Microconstruction Fabrication

Characterization and Measurement

Surface Characterization of Microconstruction

Heating Characteristics of Microconstruction

Conclusions