Abstract
Thermal responses of multilayer films play essential roles in state-of-the-art electronic systems, such as photo/micro-electronic devices, data storage systems, and silicon-on-insulator transistors. In this paper, we focus on the thermal aspects of multilayer films in the presence of a nanoscale hot spot induced by near field laser heating. The problem is set up in the scenario of heat assisted magnetic recording (HAMR), the next-generation technology to overcome the data storage density limit imposed by superparamagnetism. We characterized thermal responses of both continuous and patterned multilayer media films using transient thermal modeling. We observed that material configurations, in particular, the thermal barriers at the material layer interfaces crucially impact the temperature field hence play a key role in determining the hot spot geometry, transient response and power consumption. With a representative generic media model, we further explored the possibility of optimizing thermal performances by designing layers of heat sink and thermal barrier. The modeling approach demonstrates an effective way to characterize thermal behaviors of micro and nano-scale electronic devices with multilayer thin film structures. The insights into the thermal transport scheme will be critical for design and operations of such electronic devices.
Highlights
INTRODUCTIONFactors towards commercialization, they are compatible with each other and their combination owns the potential to push the areal density to an ultimate limit
Multilayer films play essential roles in state-of-the-art electronic systems, such as photo/microelectronic devices, data storage systems, and silicon-on-insulator transistors
Today under active development is the so-called heat-assisted-magnetic-recording (HAMR),[2,3,4,5] which uses a laser focused by a near field transducer (NFT) to locally heat a storage media placed in proximity
Summary
Factors towards commercialization, they are compatible with each other and their combination owns the potential to push the areal density to an ultimate limit. It is demonstrated that an areal density of 1 Tb/in[2] is achieved by combining these two technologies.[10] In this case, BPM relaxes HAMR’s demand on small-grain materials and HAMR makes it unnecessary to scale down the writer width in BPM. Temperature profiles are solved based on either the continuum Fourier equation or Boltzmann transport equation. The latter captures temperature slips at interfaces, the computational efforts to accommodate multiple layers with different length scales with a sub-continuum model are tremendous. We further explored performance optimization with heat sink and thermal barrier designs. This model demonstrates an effective approach to characterize thermal behaviors of micro and nano-scale electronic devices with multilayer films. The insights into various thermal aspects will be critical for design and operations of such devices
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