Thermal analysis for fundamental power coupler of HALF 499.8 MHz superconducting cavity

Abstract

The preliminary research work of Hefei Advanced Light Facility (HALF), a fourth generation diffraction limit storage ring, is in progress. Two 499.8 MHz superconducting cavities may be used in the HALF RF system. RF power will be feed into each cavity through a coaxial fundamental power coupler (FPC). Thermal design of the coupler is very important because of the large power losses on the coupler will cause overheating. Accurate and fast thermal analysis is a challenge in the thermal design. In this paper, two thermal analysis methods for evaluating the cooling effect of the coupler were compared. Computational Fluid Dynamics (CFD) code is used to perform thermal-fluid coupled analysis for the coupler in the first method, which is quite accurate but time-consuming. In the second method, average convective heat transfer coefficient calculated by correlation equations based on experimental results is used to evaluate the heat transfer between the fluid and the cooling pipe wall. The calculation time of the first method is about four times that of the second method. The simulation results of the two methods are consistent well at high flow rate, especially for turbulent flow. Therefore, the second method was used to perform thermal simulation under different cooling conditions and RF power levels. The influence of thermal radiation on the heat load to the cryogenic environment was also given in this paper. Simulation results show that thermal radiation has a slight impact on the heat load. When the copper emissivity equal to 0.02, the total static and dynamic heat load to 4.5 K are 0.833 W and 2.614 W at the power level of 200 kW, and the heat load to 4.5 K cryogenic environment caused by thermal radiation is 0.065 W.