Thermal Analysis and Research of Multi-Chip Component Substrate Based on Different Thermal Conductivity Models

Abstract

With the development of electronic packaging technology, the time criterion and the space criterion of heat transfer have been becoming smaller and smaller, which results in the stronger Non-Fourier effect．Using the classical Fourier model to analyze the heat transfer of the substrate will inevitably make the result deviate from the actual conditions greatly. However, using the Non-Fourier model could closely describe the real situation. This paper regards the Fourier model and the Non-Fourier model separately, sets up their own mathematics-physics equations to the heat-transfer model of three-dimension multi-chip module(MCM) substrate，adopts finite difference method(FDM) to solve the corresponding equations，and get the temperature field of the three-dimensional substrate model. To test the accuracy of the results, meanwhile, the thermal analysis software ANSYS ICEPAK is used to calculate the same model. The results indicate that，compared with the classical Fourier model，the results of Non-Fourier model have great advantages：the temperature value is higher, the time is longer for temperature field to enter the stable state, changing of the temperature is faster and the phenomenon of thermal coupling is stronger too.