Abstract
This work describes the thermal design of a low-voltage switchgear based on a bus plate formed by a laminated bus plate structure. It has been done within the frame of developing a new generation of low voltage switchgear system, and the main goal was to provide the scientific verification of the new bus plate concept. The work consisted of thermal network and finite element simulations, aiming to gain understanding of the thermal behavior of the different parts of the system, and leading to the design and dimensioning of the conductors. The thermal performance has been confirmed by temperature rise tests.
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