Abstract
ABSTRACTEpoxy resin was encapsulated in poly(urea–formaldehyde) microcapsules using an in situ dispersion polymerization technique. The efficiency of Ni and Cu–imidazole complexes as latent hardeners was compared to that of 2-methylimidazole. Calorimetric studies revealed higher reactivity of the nickel complex toward oxirane functionalities. Both the complexes could effectively cure the epoxy released from within the microcapsules in the event of damage followed by thermal treatment. The curing could be effected at lower temperature (Tonset = 145°C) using [Ni(2-Me-ImidH)4Cl]Cl as compared to [Cu(2-Me-ImidH)4Cl]Cl (Tonset = 152°C). A healing efficiency of 100 ± 2% could be achieved at 30% microcapsule loading, irrespective of the type of metal complex used.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
