Abstract
In this study, based on the pressure blister test technique, a theoretical study on the synchronous characterization of surface and interfacial mechanical properties of thin-film/substrate systems with residual stress was presented, where the problem of axisymmetric deformation of a blistering film with initial stress was analytically solved and its closed-form solution was presented. The expressions to determine Poisson’s ratios, Young’s modulus, and residual stress of surface thin films were derived; the work done by the applied external load and the elastic energy stored in the blistering thin film were analyzed in detail and their expressions were derived; and the interfacial adhesion energy released per unit delamination area of thin-film/substrate (i.e., energy release rate) was finally presented. The synchronous characterization technique presented here has theoretically made a big step forward, due to the consideration for the residual stress in surface thin films.
Highlights
Thin-film/substrate systems have found increasing application in many advancing technologies, such as mechanics, civil engineering, and biotechnology [1,2,3,4]
Poisson’s ratios, Young’s modulus, and residual stress of surface thin films, the elastic energy stored in the blistering film, the work done by the applied external load, the elastic strain energy stored in the enclosed compressed air, and the interfacial adhesion energy released per unit delamination area of thin-film/substrate
In light of this, the residualsystems stress in the surface thin filminitial of thin-film/substrate membrane problems) have large influence oncircular the synchronous characterization, at the same systems havewhile a large influence time, small-rotation-angle assumption should given up in order to improve the on thethe synchronous characterization, whileofatmembrane the same time, thebe small-rotation-angle assumption of accuracy of should theoretical solution
Summary
Thin-film/substrate systems have found increasing application in many advancing technologies, such as mechanics, civil engineering, and biotechnology [1,2,3,4]. The reliability of thin-film/substrate systems depends mainly on the interfacial adhesive strength of thin-film/substrate, which is usually from the polymeric adhesives or the generation of thin films. The test results for adhesive strength reflect the performance of polymeric adhesives or the effect of film generation. The determination of interfacial adhesive strength by a set of test results needs, at the same time, to know some information such as Poisson’s ratios, Young’s modulus, and residual stress of surface thin films. These information, are closely related to the fabrication of thin-film/substrate systems. For the thin films of generation the Poisson’s ratios, Young’s modulus, and residual stress of surface thin films may have difference due to the variations in processing conditions such as temperature, humidity, or the sequence of fabrication procedures, while for the adhesive thin films, the polymeric adhesives may remain on the thin films after delamination (resulting in a change of films before adhesion and after delamination), which will make a change in Poisson’s ratios and
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
